Procedure
Single-face panel process:
Material sending => Drilling => Removing burr =>Roundness transfer => Plating => Eroding board => Removing film => Etch check => Blocking soldering=> Character => Computer mill/mould rushing =>Short circuit test => Final check => Soldering-can copper protection preparation => Sample examination=> Casing => Examination => Storing=> Delivery.
Double-face panel process:
Material sending => Drilling => Removing burr => Copper sinking=> Electroforming copper=> Board milling=> Roundness transfer => Plating => Eroding board => Etch check => Blocking soldering=> Character => Computer mill/mould rushing => Short circuit test => Final check => Sample examination=> Casing => Examination => Storing=> Delivery.
Multi-face panel process:
Material sending => Lining making => Etch=> Press=> Drilling => Removing glue dregs=> Removing burr => Copper sinking => Electroforming copper=> Board milling=> Roundness transfer => Plating => Eroding board => Etch check => Blocking soldering => Character => Computer mill/mould rushing => Short circuit test => Final check => Sample examination=> Casing => Examination => Storing=> Delivery.
Facilities
Universal Etching Machine
Etching Line
Pumice
Lamination
Text Screen Printer
Text Ink Jet Printer
Tunnel Oven
Screen Printing CCD Explosure Machine
Horizontal Electro-Plating Line
CNC Routing Machine
Hitachi CNC Drilling Rig
Automatic Testing Machine
Four Wire Flying Needle Tester
Side CNC-V-CUT Machine
Metallurgical Microscope
Cut Short Laminstion
Dry Film CCD Explosure Machine
Immersion Gold Line
AOI Machine
OSP Production Line
CNC-V-CUT Machine
Test Machine
Non Destructive
